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spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 1 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate at3020qr425z1s series attention observe precautions for handling electrostatic discharge sensitive devices features 1.dimensions : 3.0mm x 2.0mm x 0.8mm. 2.higher brightness . 3.small package with high efficiency . 4.surface mount technology . 5.esd protection . 6.moisture sensitivity level : level 2a. 7.soldering methods: ir reflow soldering. 8.rohs compliant. material as follows: package : ceramics encapsulating resin : silicone resin electrodes: ag plating notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25(0.01") unless otherwise noted. 3. the specifications, characteristics and technical data descri bed in the datasheet are subject to change without prior notice . 4. the device has a single mounting surface. the devi ce must be mounted according to the specifications. package dimensions
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 2 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate selection guide absolute maximum ratings at t a = 25c notes: 1. 1/2 is the angle from optical centerline where the lumi nous intensity is 1/2 of the optical peak value. 2. luminous intensity / luminous flux: +/-15%. parameter symbol value unit power dissipation p d 600 mw junction temperature[1] t j 110 c operating temperature top -40 to + 1 0 0 c storage temperature ts t g -40 to + 11 0 c dc forward current [1] i f 150 ma peak forward current [2] i fm 300 ma thermal resistance [1](junction/ambient) r th j-a 170 c/w thermal resistance (junction/solder point) r th j-s 55 c/w 8000 v electrostatic dischar ge threshold (hbm) reverse voltage v r 5 v erp part no. color cct range (k) lens type v (lm) [2] @ 150ma v (lm) [2] @ 150ma v iewing angle [1] min. typ. max. code. min. max. typ. 2 1/2 1212000244 at3020qr425z1s-c1 cool white 5310 6000 7040 water clear b6 24 29 33 120 b7 29 35 b8 35 42 1212000246 at3020qr425z1s-n1 neutral white 3710 4000 4260 water clear b5 20 24 29 120 b6 24 29 b7 29 35 1212000277 AT3020QR425Z1S-N2 neutral white 4260 4700 5310 water clear b6 24 29 31 120 b7 29 35 b8 35 42 1212000278 at3020qr425z1s-w1 warm white 2580 2700 2870 water clear b4 17 20 24 120 b5 20 24 b6 24 29 at3020qr425z1s-w2 warm white 2870 3000 3220 water clear b5 20 24 27 120 b6 24 29 b7 29 35 1212000279 at3020qr425z1s-w3 warm white 3220 3500 3710 water clear b5 20 24 28 120 b6 24 29 b7 29 35 1212000245 notes: 1. results from mounting on pc board fr4 , m ounted on pc board-metal core pcb is recommend for lowest thermal resistance. 2. 1/10 duty cycle, 0.1ms pulse width.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 3 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate electrical / optical characteristics at t a = 25c parameter symbol value unit forward voltage i f = 150ma [min.] v f [2] 2.7 v forward voltage i f = 150ma [typ.] 3.5 forward voltage i f = 150ma [max.] 4.0 reverse current (v r = 5v) [max.] i r 10 ua temperature coefficient of x i f = 150ma, -10 c t 100 c [typ.] tc x -0.15 10 -3 / c temperature coefficient of y i f = 150ma, -10 c t 100 c [typ.] tcy -0.13 10 -3 / c temperature coefficient of v f i f = 150ma, - 10 c t 100 c [typ.] tc v -3.1 mv/ c notes: 1.forward voltage: + / -0.1v.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 4 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 5 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 6 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate at3020qr425z1s-c1 at3020qr425z1s-n1 AT3020QR425Z1S-N2 at3020qr425z1s-w1 at3020qr425z1s-w2 at3020qr425z1s-w3
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 7 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 x y 2500 k 3000 k 4000 k 5000 k 6000 k 7000 k 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 w1 w2 w3 n1 n2 c1 x y x y x y x y 1 0.4582 0.4099 8 0.4147 0.3814 15 0.3702 0.3722 0.3481 0.3557 0.4687 0.4289 0.4221 0.3984 0.3736 0.3874 0.3370 0.3472 0.4813 0.4319 0.4342 0.4028 0.3869 0.3958 0.3364 0.3328 0.4700 0.4126 0.4259 0.3853 0.3825 0.3798 0.3466 0.3411 2 0.4483 0.3919 9 0.4080 0.3916 16 0.3670 0.3578 23 0.3376 0.3616 0.4582 0.4099 0.4146 0.4089 0.3702 0.3722 0.3260 0.3512 0.4700 0.4126 0.4299 0.4165 0.3825 0.3798 0.3265 0.3371 0.4593 0.3944 0.4221 0.3984 0.3783 0.3646 0.3370 0.3472 3 0.4465 0.4071 10 0.4017 0.3751 17 0.3736 0.3874 24 0.3370 0.3472 0.4562 0.4260 0.4080 0.3916 0.3616 0.3788 0.3265 0.3371 0.4687 0.4289 0.4221 0.3984 0.3592 0.3641 0.3270 0.3230 0.4582 0.4099 0.4147 0.3814 0.3703 0.3726 0.3364 0.3328 4 0.4373 0.3893 11 0.3941 0.3848 18 0.3703 0.3726 25 0.3260 0.3512 0.4465 0.4071 0.3996 0.4015 0.3592 0.3641 0.3144 0.3408 0.4582 0.4099 0.4146 0.4089 0.3568 0.3495 0.3160 0.3274 0.4483 0.3919 0.4080 0.3916 0.3670 0.3578 0.3265 0.3371 5 0.4342 0.4028 12 0.3889 0.3690 19 0.3616 0.3788 26 0.3265 0.3371 0.4430 0.4212 0.3941 0.3848 0.3496 0.3702 0.3160 0.3274 0.4562 0.4260 0.4080 0.3916 0.3481 0.3557 0.3175 0.3139 0.4465 0.4071 0.4017 0.3751 0.3592 0.3641 0.3270 0.3230 6 0.4259 0.3853 13 0.3825 0.3798 20 0.3592 0.3641 27 0.3144 0.3408 0.4342 0.4028 0.3869 0.3958 0.3481 0.3557 0.3028 0.3304 0.4465 0.4071 0.4006 0.4044 0.3466 0.3411 0.3055 0.3177 0.4373 0.3893 0.3950 0.3875 0.3568 0.3495 0.3160 0.3274 7 0.4221 0.3984 14 0.3783 0.3646 21 0.3496 0.3702 28 0.3160 0.3274 0.4299 0.4165 0.3825 0.3798 0.3376 0.3616 0.3055 0.3177 0.4430 0.4212 0.3950 0.3875 0.3370 0.3472 0.3081 0.3049 0.4342 0.4028 0.3898 0.3716 0.3481 0.3557 0.3175 0.3139 22 cct 2500-7000 k bin code color group chromaticity regions cct (k) min. typ. max. warm white w1 1, 2, 3, 4 2580 2700 2870 w2 5, 6, 7, 8 2870 3000 3220 w3 9, 10, 11, 12 3220 3500 3710 n1 13, 14, 15, 16 3710 4000 4260 n2 17, 18, 19, 20, 21, 22 4260 4700 5310 cool white c1 23, 24, 25, 26, 27, 28 5310 6000 7040 neutral white notes: shipment may contain more than one chromaticity regions.orders for single chromaticity region are generally not accepted. measurement tolerance of the chromaticity coordinates is 0.01.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 8 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate recommended soldering pattern (units : mm ; tolerance: 0.1) reel dimension tape dimensions (units : mm) reflow soldering is recommended and the soldering profile is shown below. other soldering methods are not recommended as they might cause damage to the product.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 9 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate packing & label specifications at3020qr425z1s series packaging: 1.the leds are packed in cardboard boxes after taping. 2.the label on the minimum packing unit shows: pa rt number, lot number, ranking, quantity. 3.in order to protect the leds from mechanical sho ck, we pack them in cardboard boxes for transportation. 4.the leds may be damaged if the boxes are dropped or re ceive a strong impact against them, so precautions must be taken to prevent any damage. 5.the boxes are not water resistant and therefore must be kept away from water and moisture. 6.when the leds are transported, we recommend that you use the same packing methods as kingbright?s.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 10 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate jedec moisture sensitivity: level floor life soak requirements standard accelerated equivalent time conditions time (hours) conditions time (hours) conditions 2a 4 weeks 30 c / 60% rh 696 2 + 5 / - 0 30 c / 60% rh 120 + 1 / - 0 60 c / 60% rh notes: 1 . caution - the ??accelerated equivalent?? soak requirements shall not be used until correlation of damage response, including electrical, after soak and reflow is established with the ??standard?? soak requirements or if the known activation energy for diffusion is 0 .4 - 0.48 ev. accelerated soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. jedec document jesd22-a120 provides a method for determining the diffusion coefficient. 2 . the standard soak time includes a default value of 24 hours for se miconductor manufacturer?s exposure time (met) between bake a nd bag and includes the maximum time allowed out of the bag at the distributor?s facility. if the actual met is less than 24 hou rs the soak time may be reduced. for soak cond itions of 30 c/60% rh the soak time is reduced by one hour for each hour the met is less than 24 hours. for soak condi tions of 60 c/60% rh, the soak time is reduced by one hour for each five hours the met is less than 24 hours. if the actual met is greater than 24 hours the soak time must be increased. if soak conditions are 30 c/60% rh, the soak t ime is increased one hour for each hour that t he actual met exceeds 24 hours. if soak conditions ar e 60 c/60% rh, the soak time is increased on e hour for each five hours that the actual met exceeds 24 hours. 3 . supplier may extend the soak times at their own risk. esd protection during production electric static discharge can result when static-sensitive products come in cont act with the operator or other conductors. the following procedures may decrease the possibility of esd damage: 1.minimize friction between the product and surroundings to avoid static buildup. 2.all production machinery and test inst ruments must be electrically grounded. 3.operators must wear anti-static bracelets. 4.wear anti-static suit when entering wo rk areas with conductive machinery. 5.set up esd protection areas using grounded metal plating for component handling. 6.all workstations that handle ic and esd-sensitive components mu st maintain an electrostatic potential of 150v or less. 7.maintain a humidity level of 50% or higher in production areas. 8.use anti-static packaging for transport and storage. 9.all anti-static equipment and procedures should be peri odically inspected and evaluated for proper functionality. heat generation: 1.thermal design of the end product is of paramount importance. pl ease consider the heat generation of the led when making the system design. the coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of led placement on the board ,as we ll as other components. it is necessary to avoid intense heat generation and operate within the maximu m ratings given in this specification. 2.please determine the operating current with consideration of the ambient temperature local to the led and refer to the plot of permissible forward current vs. ambient temperature on characteristics in this specif ication. please also take meas ures to remove heat from the area near the led to improve the operational characteristics on the led. 3.the equation indicates correlation between t j and t a ,and the equation indicates correlation between t j and t s t j = t a + r thj-a *w ??? tj = t s + r thj-s *w ??? tj = dice junction temperature: c t a = ambient temperature:c t s = solder point temperature:c r thj-a = heat resistance from dice junction tem perature to ambient temperature : c/ w r thj-s = heat resistance from dice junction tem perature to ts measuring point : c/ w w = inputting power (ifx vf) : w
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 11 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate handling precautions compare to epoxy encapsulant that is hard and brittle, si licone is softer and flexible. although its characteristic significantly reduces thermal stress, it is more su sceptible to damage by external mechanical force. as a result, special handling precau tions need to be observed during asse mbly using silicone encapsulated led products. failure to comply might leads to damage and premature failure of the led. 1. handle the component along the side surfaces by using forceps or appropriate tools. 2. do not directly touch or handle the silicone lens surface. it may damage the internal circuitry. 3. do not stack together assembled pcbs containing ex posed leds. impact may scratch the silicone lens or damage the internal circuitry. 4. the outer diameter of the smd pickup nozzle should not exceed the size of the led to prevent air leaks. the inner diameter of the nozzle should be as large as possible. 5. a pliable material is suggested for the nozzle tip to avoid scratching or damaging the led surface during pickup. 6. the dimensions of the component must be accurately prog rammed in the pick-and-place mach ine to insure precise pickup and avoid damage during production.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 12 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate designing the position of led on a board. 1.no twist/warp/bent/or other stress shall be applied to the board after mounting led with solder to avoid a crack of led package. refer to the following recommended position and direction of led. appropriate led mounting is to place per pendicularly against the stress affected side . 2.depending on the position and direction of led,th e mechanical stress on the led package can be changed. refer to the following figure. 3.do not split board by hand.split with exclusive special tool. 4.if an aluminum circuit board is us ed,a large stress by thermal sho ck might cause a solder crack. for this reason,it is recommended an appropr iate verification should be taken before use.
spec no: dsak3031 rev no: v.4 date: may/27/2010 page: 13 of 13 approved: wynec checked: allen liu drawn: y.f.lv 3.0x2.0mm smd led with ceramic substrate reliability test items and conditions the reliability of products shall be sa tisfied with items listed below lot tolerance percent defective (ltpd) : 10% no. test item standards test condition test times / cycles number of damaged 1 continuous operating test - ta =25c +10/-5c ,rh=55+/-20%rh if = maximum rated current* 1,000 h 0 / 22 2 high temp. operating test - ta = 100c(+/-10c) if = maximum rated current* 1,000 h 0 / 22 3 low temp. operating test - ta = -40c+3/-5c if = maximum rated current* 1,000 h 0 / 22 4 high temp. storage test jeita ed- 4701/200 201 ta = 100c(+/-10c) ta = maximum rated storage temperature 1,000 h 0 / 22 5 low temp. storage test jeita ed- 4701/200 202 ta = -40c+3/-5c 1,000 h 0 / 22 6 high temp. & humidity storage test jeita ed- 4701/100 103 ta = 60c+5/-3c, rh = 90+5/-10%rh 1,000 h 0 / 22 7 high temp. & humidity operating test - ta = 60c+5/-3c, rh = 90%+5/-10%rh if = maximum rated current* 500h 0 / 22 8 resistance to soldering heat (reflow soldering) jeita ed- 4701/300 301 tsld=260c,10sec 2 times 0 / 22 9 solderability (reflow soldering) jeita ed- 4701/300 303 tsld=245c+/-5c,5+/-1sec 1 time over 95% 0 / 22 11 temperature cycle jeita ed- 4701/100 105 -40c(30min) ~25c(5min)~-100c (30min) ~25c(5min) 100cycles 0 / 22 12 thermal shock test mil-std- 202g ta = -40c(15min) ~100c(15min) 500 cycles 0 / 22 13 electric static discharge (esd) jeita ed- 4701/300 304 c = 100pf , r= 1.5k ? v = 2kv 3 times negative/ positive 0 / 22 * : refer to forward current vs. derating curve diagram . 14 vibration test jeita ed- 4701/400 403 100~2000~100hz sweep 4min. 200m/s2 3directions,4cycles 48min. 0 / 22 10 temperature cycle operating test - -40c(30min) ~25c(5min)~-100c (30min) ~25c(5min) if = derated current at 100c 10cycles 0 / 22 symbol test conditions criteria for judgement min. max. forward voltage v f i f = 150ma - initial level x 1.1 luminous flux v i f = 150ma initial level x 0.7 - item criteria for judging damage * : the test is performed after the board is cooled down to the room temperature.

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